TS5A1066_10 Datasheet, PDF (1/26 Pages) Texas Instruments – 10-W SPST ANALOG SWITCH

www.ti.com
FEATURES
• Low ON-State Resistance (10 Ω)
• Control Inputs Are 5.5-V Tolerant
• Low Charge Injection
• Low Total Harmonic Distortion (THD)
• 1.65-V to 5.5-V Single-Supply Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
TS5A1066
10-Ω SPST ANALOG SWITCH
SCDS185B – JANUARY 2005 – REVISED APRIL 2006
DBV OR DCK PACKAGE
(TOP VIEW)
NO 1
COM 2
GND 3
5 _V+
4 _IN
YEP OR YZP PACKAGE
(BOTTOM VIEW)
GND 3
COM 2
NO 1
4 IN
5 V₊
DESCRIPTION/ORDERING INFORMATION
The TS5A1066 is a single-pole single-throw (SPST) analog switch that is designed to operate from 1.65 V to
5.5 V. This device can handle both digital and analog signals, and signals up to V₊ (peak) can be transmitted in
either direction.
SUMMARY OF CHARACTERISTICS
Configuration
Number of channels
ON-state resistance (r_on)
ON-state resistance flatness (r_on(flat))
Turn-on/turn-off time (t_ON/t_OFF)
Charge injection (Q_C)
Bandwidth (BW)
OFF isolation (O_ISO)
Total harmonic distortion (THD)
Leakage current (I_COM(OFF)
Power-supply current (I+)
Package options
Single-Pole,
Single-Throw Demultiplexer
(1 × SPST)
1
7.5 Ω
2.5 Ω
9.5 ns/2 ns
1 pC
400 MHz
–68 dB at 10 MHz
0.14%
±0.1 µA
0.05 µA
5-pin DSBGA, SOT-23,
or SC-70
ORDERING INFORMATION
T_A
PACKAGE ⁽¹⁾
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump - YEP
NanoFree™ – WCSP (DSBGA)
–40°C to 85°C ^{0.23-mm Large Bump – YZP}
(Pb-free)
Tape and reel
ORDERABLE PART NUMBER
TS5A1066YEPR
TS5A1066YZPR
SOT (SOT-23) – DBV
Tape and reel TS5A1066DBVR
SOT (SC-70) – DCK
Tape and reel TS5A1066DCKR
TOP-SIDE MARKING⁽²⁾
JD_
JAD_
JD_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2006, Texas Instruments Incorporated