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TS3USB30E Datasheet, PDF (1/15 Pages) Texas Instruments – ESD PROTECTED, HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE
TS3USB30E
www.ti.com........................................................................................................................................................................................... SCDS255 – DECEMBER 2008
ESD PROTECTED, HIGH-SPEED USB 2.0 (480-Mbps)
1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE
FEATURES
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• VCC Operation at 3 V to 4.3 V
• 1.8-V Compatible Control-Pin Inputs
• IOFF Supports Partial Power-Down-Mode
Operation
– D+/D- Pins Tolerate up to 5.25V
• ron = 10 Ω Max
• Δron = 0.35 Ω Typ
• Cio(ON) = 7.5 pF Typ
• Low Power Consumption (1 µA Max)
• –3dB Bandwidth = 900 MHz Typ
• Latch-Up Performance Exceeds
100 mA Per JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 8000-V Human-Body Model (A114-B,
Class II)
– 1000-V Charged-Device Model (C101)
• ESD Performance I/O Port to GND (1)
– 15000-V Human-Body Model
• Packaged in 10-pin TQFN (1.4 mm × 1.8 mm)
APPLICATIONS
• Routes Signals for USB 1.0, 1.1, and 2.0
(1) High-voltage HBM is performed in addition to the standard
HBM testing (A114-B, Class II) and applies to I/O ports tested
with respect to GND only.
RSW PACKAGE
(TOP VIEW)
OE 8
VCC 9
S 10
76
12
5 D–
4 GND
3 D+
RSW PACKAGE
(BOTTOM VIEW)
S 10
VCC 9
OE 8
12
76
3 D+
4 GND
5 D–
DESCRIPTION/ORDERING INFORMATION
The TS3USB30E is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals
in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or
controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with
minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of
two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals
at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible
with various standards, such as high-speed USB 2.0 (480 Mbps).
The TS3USB30E integrates ESD protection cells on all pins, is available in a tiny µQFN package (1.8 mm ×
1.4 mm) and is charaterized over the free air temperature range from –40°C to 85°C.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated