TS3USB221_10 Datasheet, PDF (1/20 Pages) Texas Instruments – HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE

TS3USB221
www.ti.com....................................................................................................................................... SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
FEATURES
1
• V_CC Operation at 2.5 V and 3.3 V
• V_I/O Accepts Signals up to 5.5 V
• 1.8-V Compatible Control-Pin Inputs
• Low-Power Mode When OE Is Disabled (1 µA)
• r_ON = 6 Ω Maximum
• Δr_ON = 0.2 Ω Typical
• C_io(on) = 6 pF Maximum
• Low Power Consumption (30 µA Maximum)
• ESD > 2000-V Human-Body Model (HBM)
• High Bandwidth (1.1 GHz Typical)
APPLICATIONS
• Routes Signals for USB 1.0, 1.1, and 2.0
• Mobile Industry Processor Interface (MIPI)
Signal Routing
DESCRIPTION/
ORDERING INFORMATION
The TS3USB221 is a high-bandwidth switch specially
designed for the switching of high-speed USB 2.0
signals in handset and consumer applications, such
as cell phones, digital cameras, and notebooks with
hubs or controllers with limited USB I/Os. The wide
bandwidth (1.1 GHz) of this switch allows signals to
pass with minimum edge and phase distortion. The
device multiplexes differential outputs from a USB
host device to one of two corresponding outputs. The
switch is bidirectional and offers little or no
attenuation of the high-speed signals at the outputs. It
is designed for low bit-to-bit skew and high
channel-to-channel noise isolation, and is compatible
with various standards, such as high-speed USB 2.0
(480 Mbps).
DRC PACKAGE
(TOP VIEW)
1D+ ¹
1D– ²
2D+ ³
2D– ⁴
GND ⁵
10 V_CC
9_S
8 _D+
7 _D–
6 _OE
RSE PACKAGE
(TOP VIEW)
V_CC
1D+ ¹
10
9_S
1D– ²
8 _D+
2D+ ³
7 _D–
2D– ⁴
5
GND
6 _OE
RSE PACKAGE
(BOTTOM VIEW)
V_CC
S⁹
10
1 _1D+
D+ ⁸
2 _1D–
D– ⁷
3 _2D+
OE ⁶
5
GND
4 _2D–
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2008, Texas Instruments Incorporated