TS3USB221 Datasheet, PDF (1/14 Pages) Texas Instruments – HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE

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TS3USB221
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
SCDS220 – NOVEMBER 2006
FEATURES
• V_CC Operation at 2.5 V and 3.3 V
• V_IO Accepts Signals up to 5.5 V
• 1.8-V Compatible Control-Pin Inputs
• Low-Power Mode When OE Is Disabled (1 µA)
• r_on = 6 Ω Max
• ∆r_on = 0.2 Ω Typ
• C_io(on) = 6 pF Max
• Low Power Consumption (30 µA Max)
• ESD > 2000-V Human-Body Model (HBM)
• High Bandwidth (1.1 GHz Typ)
DRC PACKAGE
(TOP VIEW)
1D+
1
1D–
2
2D+
3
2D–
4
GND
5
10
V
CC
9
S
8
D+
7
D–
6
OE
APPLICATIONS
• Routes Signals for USB 1.0, 1.1, and 2.0
DESCRIPTION
The TS3USB221 is a high-bandwidth switch
specially designed for the switching of high-speed
USB 2.0 signals in handset and consumer
applications, such as cell phones, digital cameras,
and notebooks with hubs or controllers with limited
USB I/Os. The wide bandwidth (1.1 GHz) of this
switch allows signals to pass with minimum edge and
phase distortion. The device multiplexes differential
outputs from a USB host device to one of two
corresponding outputs. The switch is bidirectional
and offers little or no attenuation of the high-speed
signals at the outputs. It is designed for low bit-to-bit
skew and high channel-to-channel noise isolation,
and is compatible with various standards, such as
high-speed USB 2.0 (480 Mbps).
RSE PACKAGE
(TOP VIEW)
V_CC
1D+ 1 9 S
10
1D− 2 8 ^D+
2D+ 3 7 D−
5
2D−
4
6 OE
GND
ZXU PACKAGE
(TOP VIEW)
V_CC
1D+
S
A4 B4 C4
1D–
D+
A3 B3 C3
2D+
D–
A2 B2 C2
2D–
OE
A1 B1 C1
GND
T_A
–40°C to 85°C
DRC
RSE
ZXU
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER
Reel of 3000
TS3USB221DRCR
Reel of 3000
TS3USB221RSER
Reel of 2500
TS3USB221ZXUR
TOP-SIDE MARKING
ZWG
Preview
Preview
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated