TS3DS26227_10 Datasheet, PDF (1/19 Pages) Texas Instruments – HIGH-BANDWIDTH DUAL SPDT DIFFERENTIAL SIGNAL SWITCH WITH INPUT LOGIC TRANSLATION

TS3DS26227
www.ti.com ................................................................................................................................................ SCDS224A – JUNE 2008 – REVISED SEPTEMBER 2008
HIGH-BANDWIDTH DUAL SPDT DIFFERENTIAL SIGNAL SWITCH
WITH INPUT LOGIC TRANSLATION
FEATURES
1
•2 High-Bandwidth Data Paths – Up to 800 MHz
• Specified Break-Before-Make Switching
• Control Inputs Reference to V_IO
• Low Charge Injection
• Excellent ON-State Resistance Matching
• Low Total Harmonic Distortion (THD)
• 2.3-V to 3.6-V Power Supply (V₊)
• 1.65-V to 1.95-V Logic Supply (V_IO)
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 4000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
– 200-V Machine Model (A115-A)
APPLICATIONS
• Cell Phones
• PDAs
• Portable Instrumentation
• Low-Voltage Differential Signal Routing
• Mobile Industry Processor Interface (MIPI)
Signal Routing
YZP PACKAGE
(BOTTOM VIEW)
A BCD
1 3 4 9 10
2 2 5 8 11
3 1 6 7 12
TERMINAL ASSIGNMENTS
A
B
C
D
1
IN1
NO1
COM1
NC1
2
V_IO
GND
GND
V₊
3
IN2
NO2
COM2
NC2
DESCRIPTION/ORDERING INFORMATION
The TS3DS26227 is a dual single-pole double-throw (SPDT) analog switch that is designed to operate from
2.3 V to 3.6 V. The device offers high-bandwidth data paths, and a break-before-make feature to prevent signal
distortion during the transferring of a signal from one path to another. The device has excellent total harmonic
distortion (THD) performance and consumes very low power. These features make this device suitable for
portable applications.
The TS3DS26227 has a separate logic supply pin (V_IO) that operates from 1.65 V to 1.95 V. V_IO powers the
control circuitry, which allows the TS3DS26227 to be controlled by 1.8-V signals.
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ^{(1) (2)}
ORDERABLE PART NUMBER
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Tape and reel
TS3DS26227YZPR
TOP-SIDE MARKING⁽³⁾
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated