TRF1115 Datasheet, PDF (1/11 Pages) Texas Instruments – 2.5-GHz, High Dynamic Range, Low-Noise Down-Converter

TRF1115
www.ti.com
SLWS174B – APRIL 2005 – REVISED SEPTEMBER 2006
2.5-GHz, High Dynamic Range, Low-Noise Down-Converter
FEATURES
• Performs First Down-Conversion in MMDS /
WCS Radio 2300 MHz to 2700 MHz
• Integrated Low Noise, Variable Gain Amplifier
• Provisions For An External Image Reject /
Band Pass Filter
• Differential Mixer Provides Extra Noise
Immunity
• Integrated LO Buffer Amplifier
• 20 dB of Gain With 10 dB of Gain Control
• 3-dB Noise Figure, Typical
• Input Third Order Intercept of 0 dBm, Typical
• Input P-1 dB of –5 dBm, Typical
• LO Input Power: 3 dBm
DESCRIPTION
The TRF1115 is the first of two ASICs used in the
receiver section of Texas Instruments
MMDS/MDS/WCS/802.16x chipset. The TRF1115
down-converts the input frequency to an IF
frequency in the range of 420 MHz to 480 MHz. The
device provides a differential output that passes
through a SAW filter before connecting to a second
down converter chip. (Note: For the best
performance, the Texas Instruments TRF1112
should be used to perform both the second down
conversion and provide the local oscillator for the
TRF1115.)
In order to provide exceptional image rejection and
extra jammer rejection, the TRF1115 offers a signal
path to an off-chip filter. Specifications are provided
assuming an in-band 1.5-dB loss in this filter. The
TRF1115 includes a differential LO buffer, mixer, and
IF amplifier for improved performance. After the filter,
an on-chip balun converts the signal from
single-ended to differential in order to provide better
noise immunity in the mixer.
DEVICE INFORMATION
TRF1115
(TOP VIEW)
20 19 18 17 16
GND 1
GND 2
LNAO 3
RES 4
LOB 5
15 GND
14 IFOP
13 IFON
12 GND
11 IFB
6 7 8 9 10
P0031-03
Figure 1. TRF1115 Pin Out
BPF
LNAO
MXRI
LNA
RXI
Mixer
BALUN
VGA
IFOP
IFON
VGM
VDD
RFAGC
Power
Supply
AGC
LO Buffer
LOP
LON
Figure 2. Block Diagram
B0084-03
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2006, Texas Instruments Incorporated