TPS82692 Datasheet, PDF (1/31 Pages) Texas Instruments – High-Efficiency MicroSiP STEP-DOWN CONVERTER

TPS82692 , TPS82693, TPS82694, TPS826951
TPS82697, TPS82698, TPS82699
www.ti.com
SLVSBF8A – MARCH 2013 – REVISED JULY 2013
High-Efficiency MicroSiP^(TM) STEP-DOWN CONVERTER (PROFILE <1mm)
Check for Samples: TPS82692 , TPS82693, TPS82694, TPS826951, TPS82697, TPS82698, TPS82699
FEATURES
1
•2 Total Solution Size <6.7 mm²
• 95% Efficiency at 3MHz Operation
• 23μA Quiescent Current
• High Duty-Cycle Operation
• Best in Class Load and Line Transient
• ±2% Total DC Voltage Accuracy
• Automatic PFM/PWM Mode Switching
• Low Ripple Light-Load PFM Mode
• Excellent AC Load Regulation
• Internal Soft Start, 200-µs Start-Up Time
• Integrated Active Power-Down Sequencing
(Optional)
• Current Overload and Thermal Shutdown
Protection
• Sub 1-mm Profile Solution
APPLICATIONS
• LDO Replacement
• Cell Phones, Smart-Phones
• PoL Applications
DESCRIPTION
The TPS8269xSIP device is a complete 500mA /
800mA, DC/DC step-down power supply intended for
low-power applications. Included in the package are
the switching regulator, inductor and input/output
capacitors. No additional components are required to
finish the design.
The TPS8269xSIP is based on a high-frequency
synchronous step-down dc-dc converter optimized for
battery-powered portable applications. The
MicroSIP™ DC/DC converter operates at a regulated
3-MHz switching frequency and enters the power-
save mode operation at light load currents to maintain
high efficiency over the entire load current range.
The PFM mode extends the battery life by reducing
the quiescent current to 23μA (typ) during light load
operation. For noise-sensitive applications, the device
has PWM spread spectrum capability providing a
lower noise regulated output, as well as low noise at
the input. These features, combined with high PSRR
and AC load regulation performance, make this
device suitable to replace a linear regulator to obtain
better power conversion efficiency.
The TPS8269xSIP is packaged in a compact (2.3mm
x 2.9mm) and low profile (1.0mm) BGA package
suitable for automated assembly by standard surface
mount equipment.
V_BAT
ENABLE
TPS82693SIP
DC/DC Converter
L
VIN
SW
C_I
GND
FB
EN
MODE
V_OUT
2.85 V @ 800mA
C_O
MODE
SELECTION
GND
Figure 1. Typical Application
100.0
95.0
90.0
85.0
80.0
75.0
70.0
65.0
60.0
TPS82693
55.0 _{VOUT = 2.85V}
MODE = Low
50.0
0.1
1
10
100
Current (mA)
1000
G000
Figure 2. Efficiency vs. Load Current
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroSIP, MicroSiP are trademarks of Texas Instruments.
2
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated