TPS728XX_09 Datasheet, PDF (1/23 Pages) Texas Instruments – 200mA Low-Dropout Linear Regulator with Pin-Selectable Dual-Voltage Level Output

TPS728xx Series
www.ti.com
200mA Low-Dropout Linear Regulator
with Pin-Selectable Dual-Voltage Level Output
SBVS095 – AUGUST 2007
FEATURES
1
•2 Very Low Dropout: 230mV Typical at 200mA
• 3% Accuracy Over Load/Line/Temperature
• Low I_Q: 50μA in Active Mode
• Available in Fixed-Output Voltages From 0.9V
to 3.6V Using Innovative Factory EEPROM
Programming
• VSET Pin Toggles Output Voltage Between
Two Preset Levels
– Preset Output Voltage Levels Can Be
EEPROM-Programmed To Any Combination
• High PSRR: 65dB at 1kHz
• Stable with a 1.0μF Ceramic Capacitor
• Thermal Shutdown and Over-Current
Protection
• Available in Wafer-Level Chip Scale and
2mm x 2mm SON Packages
APPLICATIONS
• Power Rails with Programming Mode
• Dual Voltage Levels for Power-Saving Mode
• Leakage Reduction for 90nm and 65nm
Processors
• Wireless Handsets, Smart Phones, PDAs
• MP3 Players and Other Handheld Products
DESCRIPTION
The TPS728xx series of low-dropout linear regulators
(LDOs), with a selectable dual-voltage level output, is
designed specially for applications that require two
levels of output voltage regulation. Programming
fuses and memory cards, reducing leakage effects,
and conserving power in nanometric processes are
some application examples.
The VSET pin is used to select one of two output
voltage levels preset through innovative factory
EEPROM programming. A precision bandgap and
error amplifier provides an overall 3% accuracy over
load, line, and temperature extremes.
Ultra-small wafer chip scale (WCSP) and 2mm x
2mm SON packages make the TPS728xx series ideal
for handheld applications.
This family of devices is fully specified over a
temperature range of T_J = –40°C to +125°C.
TPS728xx Series
YZU PACKAGE
WCSP-5
(TOP VIEW)
IN
GND
VSET
C3 C1
B2
A3 A1
OUT
EN
TPS728xx Series
DRV PACKAGE
2mm x 2mm SON-6
(TOP VIEW)
OUT 1
VSET 2
NC 3
Thermal
Pad⁽¹⁾
6 IN
5 GND
4 EN
(1) It is recommended that the SON package
thermal pad be connected to ground.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated