TPS22907_0912 Datasheet, PDF (1/14 Pages) Texas Instruments – ULTRA SMALL, LOW-INPUT VOLTAGE, LOW rON LOAD SWITCH

TPS22907
www.ti.com
SLVSA44 – NOVEMBER 2009
ULTRA SMALL, LOW-INPUT VOLTAGE, LOW r_ON LOAD SWITCH
Check for Samples: TPS22907
FEATURES
1
• Low Input Voltage: 1.1 V to 3.6 V
• Ultra-Low ON-State Resistance
– r_ON = 44 mΩ at V_IN = 3.6 V
– r_ON = 50 mΩ at V_IN = 2.5 V
– r_ON = 58 mΩ at V_IN = 1.8 V
– r_ON = 83 mΩ at V_IN = 1.2 V
• 1-A Maximum Continuous Switch Current
• Quiescent Current < 1 µA
• Shutdown Current < 1 µA
• Low Control Input Thresholds Enable Use of
Low-Voltage Logic
• Controlled Slew Rate to Avoid Inrush Currents
• ESD Performance Tested Per JESD 22
– 3000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
• Ultra Small Four-Terminal Wafer Chip Scale
Package (WCSP)
– 0.9 mm × 0.9 mm,
0.5-mm Pitch, 0.5-mm Height
APPLICATIONS
• Battery Powered Equipment
• Portable Industrial Equipment
• Portable Medical Equipment
• Portable Media Players
• Point Of Sales Terminal
• GPS Devices
• Digital Cameras
• Portable Instrumentation
• Smartphones
YZT PACKAGE
B
B
A
A
21
12
Laser Marking View Bump View
Table 1. TERMINAL ASSIGNMENTS
B
ON
A
V_IN
2
GND
V_OUT
1
DESCRIPTION
The TPS22907 is an ultra small, low R_ON load switch with controlled turn on. The device contains a P-channel
MOSFET that operates over an input voltage range of 1.1 V to 3.6 V. The switch is controlled by an on/off input
(ON), which is capable of interfacing directly with low-voltage control signals.
The TPS22907 is available in a space-saving 4-terminal WCSP with 0.5-mm pitch (YZT). The device is
characterized for operation over the free-air temperature range of –40°C to 85°C.
DEVICE
TPS22907
r_ON
(TYP at 1.8 V)
58 mΩ
SLEW RATE
(TYP at 1.8 V)
36 μs
MAXIMUM OUTPUT
CURRENT
1000 mA
ENABLE
Active high
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE^{(1) (2)}
ORDERABLE PART NUMBER
WCSP – YZT (0.5-mm pitch)
Tape and reel TPS22907YZTR
TOP-SIDE MARKING
_ _ _ 5K_⁽³⁾
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated