TPS22903 Datasheet, PDF (1/14 Pages) Texas Instruments – ULTRA-SMALL LOW-INPUT-VOLTAGE LOW rON LOAD SWITCH

TPS22903
www.ti.com ............................................................................................................................................................................................ SLVS827 – FEBRUARY 2009
ULTRA-SMALL LOW-INPUT-VOLTAGE LOW r_ON LOAD SWITCH
FEATURES
1
• Input Voltage: 1.1 V to 3.6 V
• Ultra-Low ON-State Resistance
– r_ON = 66 mΩ at V_IN = 3.6 V
– r_ON = 75 mΩ at V_IN = 2.5 V
– r_ON = 90 mΩ at V_IN = 1.8 V
– r_ON = 135 mΩ at V_IN = 1.2 V
• 500-mA Maximum Continuous Switch Current
• Quiescent Current < 1 µA
• Shutdown Current < 1 µA
• Low Control Input Threshold Enables Use of
1.2-V/1.8-V/2.5-V/3.3-V Logic
• Controlled Slew Rate (5 µs Max at 3.6 V)
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
• 4-Terminal Wafer Chip-Scale Package (WCSP)
– 0.8 mm × 0.8 mm,
0.4-mm Pitch, 0.5-mm Height
APPLICATIONS
• PDAs
• Cell Phones
• GPS Devices
• MP3 Players
• Digital Cameras
• Peripheral Ports
• Portable Instrumentation
YFP PACKAGE
B
B
A
A
21
Laser Marking View
12
Bump View
TERMINAL ASSIGNMENTS
B
GND
ON
A
V_OUT
V_IN
2
1
DESCRIPTION
TPS22903 is an ultra-small, low r_ON dual load switch with controlled turn on. The device contains a P-channel
MOSFET that can operate over an input voltage range of 1.1 V to 3.6 V. The switch is controlled by an on/off
input (ON), which is capable of interfacing directly with low-voltage control signals.
TPS22903 is available in a space-saving 4-terminal WCSP 0.4-mm pitch (YFP). The device is characterized for
operation over the free-air temperature range of –40°C to 85°C.
FEATURE LIST
DEVICE
TPS22903
r_ON TYPICAL SLEW RATE QUICK OUTPUT
AT 3.6 V
AT 3.6 V
DISCHARGE ⁽¹⁾
69 mΩ
5 µs max
No
MAXIMUM
OUTPUT
CURRENT
500 mA
ENABLE
Active high
(1) This feature discharges the output of the switch to ground through a 120-Ω resistor, preventing the
output from floating.
ORDERING INFORMATION
T_A
–40°C to 85°C
PACKAGE ^{(1) (2)}
WCSP – YFP (0.4-mm pitch)
Tape and reel
ORDERABLE PART NUMBER
TOP-SIDE MARKING⁽³⁾
TPS22903YFPR
_ _ _4P_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated