TPD4E002 Datasheet, PDF (1/8 Pages) Texas Instruments – QUAD LOW-CAPACITANCE ARRAY WITH ±15-kV ESD PROTECTION

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TPD4E002
QUAD LOW-CAPACITANCE ARRAY
WITH ±15-kV ESD PROTECTION
SLVS615B – JULY 2006 – REVISED MARCH 2007
FEATURES
• Four Unidirectional Voltage Suppression
Diodes for use in ESD Protection
• I/O Breakdown Voltage, V_BR = 6.1 V Min
• Low I/O Capacitance (11 pF at 0 V)
• Low I/O Leakage Current <100 nA
• No Power Supply Routing is Required since
there is no V_DD Pin
• Very Small Printed Circuit Board (PCB) Area
<2.6 mm²
• ESD Protection Exceeds
– ±15-kV Human Body Model (HBM)
– ±15-kV IEC 61000-4-2 Contact Discharge
APPLICATIONS
• Where Transient Overvoltage Protection in
ESD-Sensitive Equipment is Required, Such
as:
– Computers
– Printers
– Communication Systems and Cellular
Phones
– Video Equipment
BENEFITS
• High ESD Protection Level
• High Integration
• Suitable for High-Density Boards
DRL PACKAGE
(TOP VIEW)
IO1 1
5 IO4
GND 2
IO2 3
4 IO3
DESCRIPTION/ORDERING INFORMATION
The TPD4E002 is a monolithic array designed to protect up to four lines against ESD transients. Monolithic
circuit design allows superior matching between the channels and reduced crosstalk. This device is ideal for
applications where both reduced line capacitance and board space-saving are required.
ORDERING INFORMATION
T_A
–40°C to 125°C 1.6 × 1.6 DRL
PACKAGE ⁽¹⁾
Reel of 4000
ORDERABLE PART NUMBER TOP-SIDE MARKING
TPD4E002DRLR
28S
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Absolute Maximum Ratings
V_PP ESD discharge
T_J Junction temperature
T_stg Storage temperature range
T_op Operating temperature range
Human Body Model (HBM)
IEC 61000-4-2 Contact Discharge
Thermal Resistance
R_θJA
PARAMETER
Junction to ambient on printed circuit on recommended pad layout
MIN
MAX UNIT
±15
kV
±15
125 °C
–55
150 °C
–40
125 °C
VALUE
220
UNIT
°C/W
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2007, Texas Instruments Incorporated