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TPA311 Datasheet, PDF (1/32 Pages) Texas Instruments – 350-mW MONO AUDIO POWER AMPLIFIER
TPA311
350-mW MONO AUDIO POWER AMPLIFIER
SLOS207B – JANUARY 1998 – REVISED MARCH 2000
D Fully Specified for 3.3-V and 5-V Operation
D Wide Power Supply Compatibility
2.5 V – 5.5 V
D Output Power for RL = 8 Ω
– 350 mW at VDD = 5 V, BTL
– 250 mW at VDD = 5 V, SE
– 250 mW at VDD = 3.3 V, BTL
– 75 mW at VDD = 3.3 V, SE
D Shutdown Control
– IDD = 7 µA at 3.3 V
– IDD = 60 µA at 5 V
D BTL to SE Mode Control
D Integrated Depop Circuitry
D Thermal and Short-Circuit Protection
D Surface Mount Packaging
– SOIC
– PowerPAD™ MSOP
description
D OR DGN PACKAGE
(TOP VIEW)
The TPA311 is a bridge-tied load (BTL) or
single-ended (SE) audio power amplifier devel-
oped especially for low-voltage applications
where internal speakers and external earphone
operation are required. Operating with a 3.3-V
SHUTDOWN 1
8
VO–
BYPASS 2
7
GND
SE/BTL 3
6
VDD
IN 4
5
VO+
supply, the TPA311 can deliver 250-mW of
continuous power into a BTL 8-Ω load at less than 1% THD+N throughout voice band frequencies. Although
this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as
cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the
output in most applications, which is particularly important for small battery-powered equipment. A unique
feature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive
is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load.
This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually
eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an
8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by
50% and height by 40%.
Audio
Input
RF
RI
CI
CBF
4 IN
2 BYPASS
VDD/2
–
+
VDD 6
VO+ 5
CS
CC
From System Control
From HP Jack
1 SHUTDOWN
3 SE/BTL
Bias
Control
–
VO– 8
+
7
GND
350 mW
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2000, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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