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TMS3471C Datasheet, PDF (1/19 Pages) Texas Instruments – 2/3-INCH NTSC TIMER
TMS3471C
2/3-INCH NTSC TIMER
SOCS028B – AUGUST 1991
• NTSC-Timing Operation
• Solid-State Reliability
• Monochrome Operation
• Eight Selectable-Antiblooming Modes
• Surface-Mount Package
• Clamp-Pulse Select Option
description
The TMS3471C is a monolithic integrated circuit
designed to supply timing signals for the Texas
Instruments (TI™) 11-mm diagonal TC241 mono-
chrome CCD image sensor. The TMS3471C
supplies both CCD drive signals and NTSC
television synchronization signals at standard
video rates. It requires a single 5-V supply voltage
and a 14.318-MHz crystal-oscillator input. The
TMS3471C provides several options, including
multiple antiblooming modes, clamp-pulse selec-
tion, and delayed horizontal transfer.
FS PACKAGE
(TOP VIEW)
BCP2
CP2
CP1
CSYNC
CBLK
BF
SC
SC(90)
ABS0
ABS1
ABS2
44 43 42 41 40 39 38 37 36 35 34
1
33
2
32
3
31
4
30
5
29
6
28
7
27
8
26
9
25
10
24
11
23
12 13 14 15 16 17 18 19 20 21 22
GND
SH1
SH2,3
PI
ABIN
GT
PS
PD
S2,3
S1
T
The TMS3471C is used in conjunction with
level-shifting devices such as the TI TMS3473B
parallel driver and the TI TMS3472A serial driver.
It also supplies sample-and-hold signals for the TI TL1593 three-channel sample-and-hold and multiplex signals
for the TI TL1051 video preprocessor. The TMS3471C NTSC synchronization-signal outputs include composite
sync, composite blank, clamp, subcarrier, subcarrier delayed by 90 degrees, and burst flag.
The TMS3471C is supplied in a 44-pin plastic flat package and is characterized for operation from – 20°C
to 45°C.
This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These
circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C,
Method 3015; however, precautions should be taken to avoid application of any voltage higher than maximum-rated voltages to these
high-impedance circuits. During storage or handling, the device leads should be shorted together or the device should be placed in
conductive foam. In a circuit, unused inputs should always be connected to an appropriate logic voltage level, preferably either VCC or ground.
Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices and Assemblies available from Texas Instruments.
TI is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright © 1991, Texas Instruments Incorporated
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