TMP006_1107 Datasheet, PDF (1/21 Pages) Texas Instruments – Infrared Thermopile Sensor in Chip-Scale Package

TMP006
www.ti.com
SBOS518A – MAY 2011 – REVISED JULY 2011
Infrared Thermopile Sensor in Chip-Scale Package
Check for Samples: TMP006
FEATURES
1
•23 Complete Solution in 1,6 mm × 1,6 mm Wafer
Chip-Scale Package (WCSP) IC (DSBGA)
• Digital Output:
– Sensor Voltage: 7 μV/°C
– Local Temperature: –40°C to +125°C
• SMBus™ Compatible Interface
• Pin-Programable Interface Addressing
• Low Supply Current: 240 μA
• Low Minimum Supply Voltage: 2.2 V
APPLICATIONS
• Notebook Case Temperature
• Comfort Index Measurement
• Motor Case Temperature
• Server Farm Power Management
DESCRIPTION
The TMP006 is the first in a series of temperature
sensors that measure the temperature of an object
without the need to make contact with the object. This
sensor uses a thermopile to absorb the infrared
energy emitted from the object being measured and
uses the corresponding change in thermopile voltage
to determine the object temperature.
Infrared sensor voltage range is specified from –40°C
to +125°C to enable use in a wide range of
applications. Low power consumption along with low
operating voltage makes the part suitable for
battery-powered applications. The low package
height of the chip-scale format enables standard high
volume assembly methods, and can be useful where
limited spacing to the object being measured is
available.
Histogram
20
T_Object = 20°C
T_Local = 20°C
15
-3 s
+3 s
10
5
0
-3
-2
-1
0
1
2
3
T_Object Error (°C)
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SMBus is a trademark of Intel Corporation.
2
All other trademarks are the property of their respective owners.
3
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated