TMC57253 Datasheet, PDF (1/11 Pages) Texas Instruments – DRIVER

• TTL-Compatible Inputs
• CCD-Compatible Outputs
• Adjustable Clock Levels
• High-Speed Clear
• Serial-Gate Midlevel for CDS Operation
• Solid-State Reliability
description
The TMC57253 is a monolithic CMOS integrated
circuit designed to drive image-area gates (IAG1,
IAG2), antiblooming gate (ABG), storage-area
gate (SAG), and serial-register gate (SRG) of the
Texas Instruments (TI™) TC255 CCD image
sensor. The TMC57253 interfaces the CCD image
sensor to the TI TMC57751 ASIC or user-defined
timing generator; it receives TTL-input signals
from the timing generator and outputs level-
shifted signals to the image sensor.
ABOUT follows ABIN and ABMIN and switches
between V_ABL, V_AB, and V_ABM. IA1OUT and
IA2OUT follow IA1IN and IA2IN, respectively, and
switch between GND and V_IA. The SAOUT output
follows the SAIN and switches GND and V_S.
SROUT follows SRIN and SRMIN and switches
between GND, V_SM, and V_S.
The TMC57253 is available in a 24-pin HSOP-B
surface-mount package and is characterized for
operation from – 20°C to 45°C.
TMC57253
DRIVER
SOCS040A – MARCH 1994 – REVISED NOVEMBER 1994
HSOP TYPE-B
(TOP VIEW)
V_AB
1
V_CC
2
GND
3
EN
4
ABIN
5
ABMIN
6
IA1IN
7
IA2IN
8
SAIN
9
SRIN
10
SRMIN
11
GND
12
24
V_ABM
23
ABOUT
22
V_ABL
21
GND
20
IA1OUT
19
V_IA
18
IA2OUT
17
GND
16
SAOUT
15
V_S
14
SROUT
13
V_SM
logic symbol
4
EN
5
ABIN
6
ABMIN
24
VABM
10
SRIN
11
SRMIN
VSM ¹³
7
IA1IN
8
IA2IN
9
SAIN
Φ
TTL/CCD
23
ABOUT
14
SROUT
20
IA1OUT
18
IA2OUT
16
SAOUT
This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These
circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C,
Method 3015; however, it is advised that precautions be taken to avoid application of any voltage higher than maximum-rated voltages
to these high-impedance circuits. During storage or handling, the device leads should be shorted together or the device should be
placed in conductive foam. In a circuit, unused inputs should always be connected to an appropriated logic voltage level, preferably either VCC
or ground. Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling
Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments.
TI is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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Copyright © 1994, Texas Instruments Incorporated
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