TLV7211_07 Datasheet, PDF (1/19 Pages) Texas Instruments – CMOS COMPARATORS WITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT

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TLV7211, TLV7211A
CMOS COMPARATORS
WITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT
SLCS149B – AUGUST 2006 – REVISED JANUARY 2007
FEATURES
• Parameters Specified at 2.7-V, 5-V, and 15-V
Supplies
• Supply Current 7 µA (Typ) at 5 V
• Response Time 4 µs (Typ) at 5 V
• Push-Pull Output
• Input Common-Mode Range Beyond
V_CC– and V_CC+
• Low Input Current
APPLICATIONS
• Battery-Powered Products
• Notebooks and PDAs
• Mobile Communications
• Alarm and Security Circuits
• Direct Sensor Interface
• Replaces Amplifiers Used as Comparators
With Better Performance and Lower Current
D PACKAGE
(TOP VIEW)
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
NC 1
IN– 2
IN+ 3
V_CC– 4
8 NC
7 V_CC+
6 OUT
5 NC
NC – No internal connection
OUT 1
V_CC+ 2
IN+ 3
5 V_CC–
4 IN–
OUT 1
V_CC+ 2
IN+ 3
6 NC
5 V_CC–
4 IN–
DESCRIPTION/ORDERING INFORMATION
The TLV7211 and TLV7211A are micropower CMOS comparators available in the space-saving SOT-23-5
package. This makes the comparators ideal for space- and weight-critical designs. The TLV7211A features an
input offset voltage of 5 mV, and the TLV7211 features an input offset voltage of 15 mV.
The main benefits of the SOT-23-5 package are most apparent in small portable electronic devices, such as
mobile phones, pagers, notebook computers, personal digital assistants, and PCMCIA cards. The rail-to-rail
input voltage makes the TLV7211 or TLV7211A a good choice for sensor interfacing, such as light detector
circuits, optical and magnetic sensors, and alarm and status circuits.
The SOT-23-5 package's small size allows it to fit into tight spaces on PC boards.
ORDERING INFORMATION
T_A
–40°C to 85°C
V_OS
(MAX)
5 mV
15 mV
PACKAGE ⁽¹⁾
SOIC – D
SOT-23-5 – DBV
SOT (SC-70) – DCK
SOIC – D
SOT-23-5 – DBV
SOT (SC-70) – DCK
Reel of 2500
Tube of 75
Reel of 3000
Reel of 3000
Reel of 250
Reel of 2500
Tube of 75
Reel of 3000
Reel of 3000
Reel of 250
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
TLV7211AIDR
TLV7211AID
TLV7211AIDBVR
TLV7211AIDCKR
TLV7211AIDCKT
TLV7211IDR
TLV7211ID
TLV7211IDBVR
TLV7211IDCKR
TLV7211IDCKT
7211AI
YBN_
Y8_
TY7211
YBK_
Y7_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2007, Texas Instruments Incorporated