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TLV2772Y Datasheet, PDF (1/32 Pages) Texas Instruments – 2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT DUAL OPERATIONAL AMPLIFIERS
D High Slew Rate . . . 10.5 V/µs Typ
D High-Gain Bandwidth . . . 5.1 MHz Typ
D Supply Voltage Range 2.7 V to 5 V
D Rail-to-Rail Output
D 360 µV Input Offset Voltage
D Low Distortion Driving 600-Ω
0.005% THD+N
D 1 mA Supply Current (Per Channel)
D 17 nV/√Hz Input Noise Voltage
D 2 pA Input Bias Current
D Characterized from TA = – 40°C to 125°C
D Available in MSOP (DGK) Package
description
TLV2772, TLV2772A, TLV2772Y
2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT
DUAL OPERATIONAL AMPLIFIERS
SLOS209 – JANUARY 1998
D OR P PACKAGE
(TOP VIEW)
1OUT 1
1IN – 2
1IN + 3
VDD– /GND 4
8 VDD+
7 2OUT
6 2IN –
5 2IN+
1OUT
1IN –
1IN+
VDD – /GND
DGK PACKAGE
(TOP VIEW)
1
8
2
7
3
6
4
5
VDD+
2OUT
2IN –
2IN+
The TLV2772 dual CMOS operational amplifier combines high slew rate and bandwidth, rail-to-rail output swing,
high output drive and excellent dc precision. The device provides 10.5 V/µs of slew rate and 5.1 MHz of
bandwidth while only consuming 1 mA of supply current per channel. This ac performance is much higher than
current competitive CMOS amplifiers. The rail-to-rail output swing and high output drive makes this device a
good choice for driving the analog input or reference of analog-to-digital converters. The device also has low
distortion while driving a 600-Ω load for use in telecom systems.
The amplifier has a 360 µV input offset voltage, a 17 nV ǸHz input noise voltage, and a 2 pA input bias current
for measurement, medical, and industrial applications. The TLV2772 is also specified across an extended
temperature range (– 40°C to 125°C) making it useful for automotive systems.
The device operates from a 2.2 V to 5.5 V single supply voltage and is characterized at 2.7 V and 5 V. The single
supply operation and low power consumption make this device a good solution for portable applications. It is
available in an 8-pin PDIP, SOIC and ultra-low profile MSOP package.
AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax AT 25°C SMALL OUTLINE†
MSOP
(D)
(DGK)
0°C to 70°C
2.5
TLV2772CD
TLV2772CDGK
– 40°C to 125°C
2.5
TLV2772ID
TLV2772IDGK
1.6
TLV2772AID
TLV2772AIDGK
† The D packages are available taped and reeled. Add R suffix to the device type (e.g., TLV2772CDR).
‡ Chip forms are tested at TA = 25°C only.
PLASTIC DIP
(P)
TLV2772CP
TLV2772IP
TLV2772AIP
CHIP FORM‡
(Y)
TLV2772Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
This document contains information on products in more than one phase
of development. The status of each device is indicated on the page(s)
specifying its electrical characteristics.
Copyright © 1998, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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