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TLV2721 Datasheet, PDF (1/28 Pages) Texas Instruments – Advanced LinCMOSE RAIL-TO-RAIL VERY LOW-POWER SINGLE OPERATIONAL AMPLIFIERS
TLV2721, TLV2721Y
Advanced LinCMOS™ RAIL-TO-RAIL
VERY LOW-POWER SINGLE OPERATIONAL AMPLIFIERS
SLOS197 – AUGUST1997
D Output Swing Includes Both Supply Rails
D Low Noise . . . 19 nV/√Hz Typ at f = 1 kHz
D Low Input Bias Current . . . 1 pA Typ
D Fully Specified for Single-Supply 3-V and
5-V Operation
D Very Low Power . . . 110 µA Typ
D Common-Mode Input Voltage Range
Includes Negative Rail
D Wide Supply Voltage Range
2.7 V to 10 V
D Macromodel Included
DBV PACKAGE
(TOP VIEW)
OUT
1
5
VDD– /GND
VDD+
2
IN +
3
4
IN–
description
The TLV2721 is a single low-voltage operational amplifier available in the SOT-23 package. It offers a
compromise between the ac performance and output drive of the TLV2731 and the micropower TLV2711.
It consumes only 150 µA (max) of supply current and is ideal for battery-powered applications. The device
exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The
TLV2721 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.
The TLV2721, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for
high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels
combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing
applications. In addition, the rail-to-rail output feature with single or split supplies makes this family a great
choice when interfacing with analog-to-digital converters (ADCs).
With a total area of 5.6mm2, the SOT-23 package only requires one third the board space of the standard 8-pin
SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal
source, minimizing noise pick-up from long PCB traces.
AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax AT 25°C
SOT-23 (DBV)†
0°C to 70°C
3 mV
TLV2721CDBV
– 40°C to 85°C
3 mV
TLV2721IDBV
† The DBV package available in tape and reel only.
‡ Chip forms are tested at TA = 25°C only.
SYMBOL
VAKC
VAKI
CHIP
FORM‡
(Y)
TLV2721Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Advanced LinCMOS is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 1997, Texas Instruments Incorporated
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