TLV2361 Datasheet, PDF (1/17 Pages) Texas Instruments – HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS

TLV2361, TLV2361Y, TLV2362, TLV2362Y
HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
SLOS195B – FEBRUARY 1997 – REVISED OCTOBER 1998
D Low Supply-Voltage
Operation . . . V_CC = ±1 V Min
D Wide Bandwidth . . . 7 MHz Typ at
V_CC± = ±2.5 V
D High Slew Rate . . . 3 V/µs Typ at
V_CC± = ±2.5 V
D Wide Output Voltage Swing . . . ±2.4 V Typ
at V_CC± = ±2.5 V, R_L = 10 kΩ
D Low Noise . . . 8 nV/√Hz Typ at f = 1 kHz
D Package Options Include SOT-23 (DBV)
Package for the TLV2361 and Plastic
Small-Outline (D), Thin Shrink
Small-Outline (PW), and Dual-In-Line (P)
Packages for the TLV2362
TLV2361 . . . DBV PACKAGE
(TOP VIEW)
IN+ 1 ⁵
V_CC+
V_CC–
2
IN– _{3 4}
OUT
TLV2362 . . . D, P, OR PW PACKAGE
(TOP VIEW)
1OUT 1
1IN– 2
1IN+ 3
V_CC– 4
8 V_CC+
7 2OUT
6 2IN–
5 2IN+
description
The TLV236x devices are high-performance dual operational amplifiers built using an original Texas
Instruments bipolar process. These devices can be operated at a very low supply voltage (±1 V), while
maintaining a wide output swing. The TLV236x devices offer a dramatically improved dynamic range of signal
conditioning in low-voltage systems. The TLV236x devices also provide higher performance than other
general-purpose operational amplifiers by combining higher unity-gain bandwidth and faster slew rate. With
their low distortion and low-noise performance, these devices are well suited for audio applications.
The C-suffix devices are characterized for operation from 0°C to 70°C and the I-suffix devices are characterized
for operation from –40°C to 85°C.
TLV2361 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
SOT-23
SYMBOL
(DBV)†
0°C to 70°C
TLV2361CDBV
VAAC
–40°C to 85°C
TLV2361IDBV
VAAI
† _{The DBV packages are only available taped and reeled.}
‡ _{Chip forms are specified for operation at 25°C only.}
CHIP
FORM‡
(Y)
TLV2361Y
TLV2362 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
TA
SMALL OUTLINE§ PLASTIC DIP
TSSOP^¶
FORM‡
(D)
(P)
(PW)
(Y)
–20°C to 85°C
TLV2362ID
TLV2362IP TLV2362IPWR TLV2362Y
‡ _{Chip forms are specified for operation at 25°C only.}
§ _{The D packages are available taped and reeled. Add an R to the package suffix (e.g., TLV2362IDR).}
¶ _{The PW packages are available left-ended taped and reeled only, (e.g., TLV2362IPWR).}
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright © 1998, Texas Instruments Incorporated
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