TLV1018 Datasheet, PDF (1/12 Pages) Texas Instruments – AMPLIFIER FOR THREE-WIRE ANALOG ELECTRET MICROPHONES

TLV1018
www.ti.com .......................................................................................................................................... SLVS664A – OCTOBER 2008 – REVISED NOVEMBER 2008
AMPLIFIER FOR THREE-WIRE ANALOG ELECTRET MICROPHONES
FEATURES
1
•2 Output Voltage Noise (A Weighted):
–89 dBV (Typ)
• Low Supply Current: 70 µA (Typ)
• Wide Supply Voltage Range: 1.7 V to 5 V
• PSRR: 70 dB (Typ)
• Signal-to-Noise Ratio: 61 dB (Typ)
• Input Capacitance: 2 pF (Typ)
• Input Impedance: >100 MΩ (Typ)
• Output Impedance: <100 Ω (Typ)
• Maximum Input Signal: 170 mV_PP (Typ)
APPLICATIONS
• Mobile Communications, Bluetooth
• Automotive Accessories
• Cellular Phones
• PDAs
• Accessory Microphone Products
YDC PACKAGE
(TOP VIEW)
OUTPUT A2 B2 V
CC
GND ^{A1 B1} INPUT
DESCRIPTION/ORDERING INFORMATION
The TLV1018 is an audio amplifier for small-form-factor electret microphones and is designed to replace the
currently implemented JFET preamplifiers. The TLV1018 is ideal for extended battery-life applications, such as a
Bluetooth™ communication link. The addition of a third pin to an electret microphone that incorporates a
TLV1018 allows for a dramatic reduction in supply current compared to a JFET-equipped electret microphone.
Microphone supply current is reduced to 70 µA, assuring longer battery life.
The TLV1018 is specified for supply voltages from 1.7 V to 5 V and has fixed voltage gains of 15 dB and 25 dB.
It offers low output impedance over the voice bandwidth, excellent power supply rejection (PSRR), and stability
over temperature.
The TLV1018 is offered in a space-saving four-terminal ultra-thin lead-free package (YDC) and is ideally suited
for the form factor of miniature electret microphone packages. The TLV1018 is characterized for operation over a
free-air temperature range of –40°C to 85°C.
T_A
–40°C to 85°C
A_V
15 dB
25 dB
ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER
NanoStar™ WCSP
(DSBGA) – YDC
Reel of 3000
TLV1018-15YDCR
TLV1018-25YDCR
TOP-SIDE MARKING
Y28
YW8
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a trademark of Bluetooth SIG.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated