TLC976C Datasheet, PDF (1/17 Pages) Texas Instruments – 10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR

TLC976C
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR
D Correlated Double Sampling (CDS), AGC
and High Speed 10-Bit ADC in a Single
Package
D 5-V Analog Power Supply and 3.3-V Digital
Power Supply
D Power Down Mode
D 56-Pin TSSOP (DGG) Package with
Multichip Module Assembly for Isolation
CDS/AGC
D AGC Gain Range of 5 dB to 39 dB
D Black Level Clamp Circuit
D Direct Connection to ADC Input
D Voltage Reference for ADC
Analog-to-Digital Converter
D 10-Bit Resolution
D Maximum Conversion Rate . . . 20 MSPS
(MIN)
D Differential Nonlinearity . . . 0.75 LSB (TYP)
D Analog Input Voltage Range of 2 Vp-p
D 3.3 V CMOS Digital Interface
Applications
D PC Camera
D Digital Camera
D Camcorder
D CCD Scanner
SLAS193 – OCTOBER 1998
DGG PACKAGE
(TOP VIEW)
SHV ₁
GND1 ₂
BLK-PULSE ₃
OFFSET 4
VCC3 5
DRIVE-OUT 6
GND3 7
CDS-STBY 8
VRB-OUT 9
VRT-OUT 10
A-SUB 11
D-SUB 12
DVSS 13
D0 14
D1 15
D2 16
D3 17
D4 18
DVSS 19
DVDD 20
D5 21
D6 22
D7 23
D8 ²⁴
D9 ²⁵
RESET ²⁶
DVSS ²⁷
AVDD ²⁸
56 ^SHR
55 ^VCC1
54 ^CLP2
53 DATA-IN
52 PIN
51 AGCGAIN
50 OBCLP
49 AGCCLP
48 SH-PULSE
47 GND2
46 VCC2
45 A-SUB
44 DVDD
43 AVSS
42 AVSS
41 VIN
40 D-SUB
39 AVSS
38 VRB-IN
37 VRB-IN
36 VRT-IN
35 VRT-IN
34 AVSS
33 _AVDD
32 _AVDD
31 _AD-STBY
30 _OE
29 _CLK
description
The TLC976 is a multichip module (MCM) subsystem designed for interfacing Charge-Coupled Device (CCD)
in camcorder and digital camera systems. The TLC976 includes correlated double sampler (CDS), automatic
gain control (AGC), black level clamp circuit, 10 bit, 20 MSPS analog-to-digital converter (ADC), and internal
reference voltage generator for ADC.
The CDS/AGC can be connected directly to the ADC input or a separate signal can be connected directly to
the ADC input. A power-down mode is provided.
Assembled using the MCM process, the TLC976 provides isolation between the noisy digital domain and the
noise sensitive analog signals. The CDS/PGA, black level clamps are on one die and the ADC is on a separate
die. The separate dies significantly reduce the substrate noise to the analog section.
The TLC976 comes in a 56-pin TSSOP package with 0,50 mm pin pitch. This is about 25% smaller than using
two separate 32-pin quad flat packs (QFP).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright © 1998, Texas Instruments Incorporated
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