TC221 Datasheet, PDF (1/14 Pages) Texas Instruments – SMALL-FORMAT CCD IMAGE SENSORS

TC221, TC225, TC227
SMALL-FORMAT CCD IMAGE SENSORS
• Full-Frame Operation
– 190 (H) × 190 (V) Active Elements for TC221
– 285 (H) × 285 (V) Active Elements for TC225
– 102 (H) × 102 (V) Active Elements for TC227
• Dark-Reference Pixels
• 9-µm Square Pixels
• Single-Phase Clocking
• Low Dark Current
• Dynamic Range . . . More Than 60 dB
• High Photoresponse Uniformity
• High Sensitivity
• Low-Noise Operation
• Solid State Reliability With No Residual
Imaging, Image Burn-In, Microphonics, or
Image Distortion
SOCS037C – DECEMBER 1991 – REVISED AUGUST 1997
TC225
TRG
1
SRG1
2
SRG2
3
ABG
4
IAG
5
10
SUB
9
OUT1
8
OUT2
7
ADB
6
NC
NC – No internal connection
TC221
description
The TC221, TC225 and TC227 are full-frame
charge-coupled device (CCD) image sensors
designed specifically for medical and industrial
applications where ruggedness and small size are
required. The image-area diagonal measures
1.3 mm for the TC227, 2.4 mm for the TC221, and
3.63 mm for the TC225. The image sensors
contain, in addition to dark reference pixels, 190,
285, and 102 active lines with 190, 285, and 102
active pixels per line, respectively. The
antiblooming feature is activated by supplying
clock pulses to the antiblooming gate, an integral
part of each image-sensing element. The charge
is converted to signal voltage at 9.5 µV per
electron by a high-performance structure with
built-in automatic reset and a voltage-reference
generator. The signal is further buffered by a
low-noise two-stage source-follower amplifier to
provide high output-drive capability.
SRG
1
ABG
2
IAG
3
6
SUB
5
OUT
4
ADB
TC227
SUB 1
OUT
2
ADB 3
6 SRG
5 ABG
4 IAG
The TC221 and TC227 are supplied in 6-pin molded plastic packages; the TC225 is supplied in a 10-pin molded
plastic package. The glass window can be cleaned using any standard method for cleaning optical assemblies
or by wiping the surface with a cotton swab soaked in alcohol.
This MOS device contains limited built-in gate protection. During storage or handling, the device leads should be shorted together
or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to SUB. Under no
circumstances should pin voltages exceed absolute maximum ratings. Avoid shorting OUTn to ADB during operation to prevent
damage to the amplifier. The device can also be damaged if the output terminals are reverse-biased and an excessive current is
allowed to flow. Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling
Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 1997, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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