SN74LVTH574_07 Datasheet, PDF (1/23 Pages) Texas Instruments – 3.3V ABT OCTAL EDGE-TRIGGERED D-TYPE FLIP FLOPS WITH 3 STATE OUTPUTS

SN54LVTH574, SN74LVTH574
3.3ĆV ABT OCTAL EDGEĆTRIGGERED DĆTYPE FLIPĆFLOPS
WITH 3ĆSTATE OUTPUTS
SCBS688G − MAY 1997 − REVISED SEPTEMBER 2003
D Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V V_CC)
D Support Unregulated Battery Operation
Down to 2.7 V
D Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
D I_off and Power-Up 3-State Support Hot
Insertion
D Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
D Latch-Up Performance Exceeds 500 mA Per
JESD 17
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
SN54LVTH574 . . . J OR W PACKAGE
SN74LVTH574 . . . DB, DW, NS,
OR PW PACKAGE
(TOP VIEW)
OE 1
1D 2
2D 3
3D 4
4D 5
5D 6
6D 7
7D 8
8D 9
GND 10
20 V_CC
19 1Q
18 2Q
17 3Q
16 4Q
15 5Q
14 6Q
13 7Q
12 8Q
11 CLK
SN74LVTH574 . . . RGY PACKAGE
(TOP VIEW)
1
1D 2
2D 3
3D 4
4D 5
5D 6
6D 7
7D 8
8D 9
10
20
19 1Q
18 2Q
17 3Q
16 4Q
15 5Q
14 6Q
13 7Q
12 8Q
11
SN54LVTH574 . . . FK PACKAGE
(TOP VIEW)
3D
3 2 1 20 19
4
18
2Q
4D 5
17 ^3Q
5D 6
16 4Q
6D 7
15 5Q
7D 8
14 6Q
9 10 11 12 13
description/ordering information
These octal flip-flops are designed specifically for low-voltage (3.3-V) V_CC operation, but with the capability to
provide a TTL interface to a 5-V system environment.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
QFN − RGY
Tape and reel SN74LVTH574RGYR LXH574
SOIC − DW
Tube
Tape and reel
SN74LVTH574DW
SN74LVTH574DWR
LVTH574
SOP − NS
Tape and reel SN74LVTH574NSR LVTH574
−40°C to 85°C
SSOP − DB
TSSOP − PW
Tape and reel
Tube
Tape and reel
SN74LVTH574DBR
SN74LVTH574PW
SN74LVTH574PWR
LXH574
LXH574
VFBGA − GQN
VFBGA − ZQN (Pb-free)
Tape and reel
SN74LVTH574GQNR
LXH574
SN74LVTH574ZQNR
CDIP − J
Tube
SNJ54LVTH574J
SNJ54LVTH574J
−55°C to 125°C CFP − W
Tube
SNJ54LVTH574W
SNJ54LVTH574W
LCCC − FK
Tube
SNJ54LVTH574FK
SNJ54LVTH574FK
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are}
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright  2003, Texas Instruments Incorporated
On products compliant to MILĆPRFĆ38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
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