SN74LVC3GU04 Datasheet, PDF (1/11 Pages) Texas Instruments – TRIPLE INVERTER GATE

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FEATURES
• Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 3.9 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• Typical V_OLP (Output Ground Bounce)
< 0.8 V at V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot)
> 2 V at V_CC = 3.3 V, T_A = 25°C
• Unbuffered Outputs
• Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN74LVC3GU04
TRIPLE INVERTER GATE
SCES539A – JANUARY 2004 – REVISED APRIL 2005
DCT OR DCU PACKAGE
(TOP VIEW)
1A 1
3Y 2
2A 3
GND 4
8 V_CC
7 1Y
6 3A
5 2Y
YEP OR YZP PACKAGE
(BOTTOM VIEW)
GND 4 5 2Y
2A 3 6 3A
3Y 2 7 1Y
1A 1 8 V_CC
DESCRIPTION/ORDERING INFORMATION
This triple inverter is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC3GU04 contains three inverters with unbuffered outputs and performs the Boolean function Y = A.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
T_A
–40°C to 85°C
PACKAGE ⁽¹⁾
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SSOP – DCT
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
Reel of 3000
SN74LVC3GU04YEPR
SN74LVC3GU04YZPR
_ _ _CD_
Reel of 3000 SN74LVC3GU04DCTR
CU4_ _ _
VSSOP – DCU
Reel of 3000 SN74LVC3GU04DCUR
Reel of 250 SN74LVC3GU04DCUT
CU4_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ⋅ = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated