SN74LVC3G14 Datasheet, PDF (1/13 Pages) Texas Instruments – TRIPLE SCHMITT TRIGGER INVERTER

SN74LVC3G14
TRIPLE SCHMITTĆTRIGGER INVERTER
D Available in the Texas Instruments
NanoStar and NanoFree Packages
D Supports 5-V V_CC Operation
D Inputs Accept Voltages to 5.5 V
D Max t_pd of 5.4 ns at 3.3 V
D Low Power Consumption, 10-µA Max I_CC
D ±24-mA Output Drive at 3.3 V
D Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
D Typical V_OHV (Output V_OH Undershoot)
>2 V at V_CC = 3.3 V, T_A = 25°C
D I_off Feature Supports Partial-Power-Down
Mode Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
SCES367G − AUGUST 2001 − REVISED SEPTEMBER 2003
DCT OR DCU PACKAGE
(TOP VIEW)
1A 1
3Y 2
2A 3
GND 4
8 V_CC
7 1Y
6 3A
5 2Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND 4 5 2Y
2A 3 6 3A
3Y 2 7 1Y
1A 1 8 V_CC
This triple Schmitt-trigger inverter is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC3G14 contains three inverters and performs the Boolean function Y = A. The device functions as
three independent inverters but, because of Schmitt action, it may have different input threshold levels for
positive-going (V_T+) and negative-going (V_T−) signals.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74LVC3G14YEAR
−40°C to 85°C
NanoFree − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
Reel of 3000
SN74LVC3G14YZAR
SN74LVC3G14YEPR
SN74LVC3G14YZPR
_ _ _CF_
SSOP − DCT
Reel of 3000 SN74LVC3G14DCTR C14_ _ _
VSSOP − DCU
Reel of 3000
Reel of 250
SN74LVC3G14DCUR
SN74LVC3G14DCUT
C14_
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.}
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2003, Texas Instruments Incorporated
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