SN74LVC3G07_08 Datasheet, PDF (1/12 Pages) Texas Instruments – TRIPLE BUFFER / DRIVER WITH OPEN DRAIN OUTPUTS

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SN74LVC3G07
TRIPLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
SCES365J – AUGUST 2001 – REVISED FEBRUARY 2007
FEATURES
• Available in the Texas Instruments
NanoFree™ Package
• Supports 5-V V_CC Operation
• Max t_pd of 3.7 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• Input and Open-Drain Output Accepts
Voltages up to 5.5 V
• Typical V_OLP (Output Ground Bounce) <0.8 V
at V_CC = 3.3 V, T_A = 25°C
DCT PACKAGE
(TOP VIEW)
• Typical V_OHV (Output V_OH Undershoot) >2 V at
V_CC = 3.3 V, T_A = 25°C
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCU PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
1A
1
3Y
2
2A
3
8
V_CC
7
1Y
6
3A
1A 1
3Y 2
2A 3
GND 4
8
V_CC
7 1Y
6 3A
5 2Y
GND 4 5 2Y
2A ^{3 6} 3A
3Y ² 7 1Y
1A
1 8 _VCC
GND
4
5
2Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This triple buffer/driver is designed for 1.65-V to 5.5-V V_CC operation.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
The output of the SN74LVC3G07 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000
SN74LVC3G07YZPR
_ _ _CV
SSOP – DCT
Reel of 3000 SN74LVC3G07DCTR
C07_ _ _
VSSOP – DCU
Reel of 3000
Reel of 250
SN74LVC3G07DCUR
SN74LVC3G07DCUT
C07_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2007, Texas Instruments Incorporated