SN74LVC3G07 Datasheet, PDF (1/13 Pages) Texas Instruments – TRIPLE BUFFER / DRIVER WITH OPEN DRAIN OUTPUTS

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FEATURES
• Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
• Supports 5-V V_CC Operation
• Max t_pd of 3.7 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• Input and Open-Drain Output Accepts
Voltages up to 5.5 V
• Typical V_OLP (Output Ground Bounce) <0.8 V
at V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot) >2 V at
V_CC = 3.3 V, T_A = 25°C
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN74LVC3G07
TRIPLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
SCES365H – AUGUST 2001 – REVISED JUNE 2005
DCT OR DCU PACKAGE
(TOP VIEW)
1A 1
3Y 2
2A 3
GND 4
8 V_CC
7 1Y
6 3A
5 2Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND 4 5 2Y
2A 3 6 3A
3Y 2 7 1Y
1A 1 8 V_CC
DESCRIPTION/ORDERING INFORMATION
This triple buffer/driver is designed for 1.65-V to 5.5-V V_CC operation.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
SN74LVC3G07YEAR
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
Reel of 3000
SN74LVC3G07YZAR
SN74LVC3G07YEPR
_ _ _CV_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SN74LVC3G07YZPR
SSOP – DCT
Reel of 3000 SN74LVC3G07DCTR
C07_ _ _
VSSOP – DCU
Reel of 3000
Reel of 250
SN74LVC3G07DCUR
SN74LVC3G07DCUT
C07_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2005, Texas Instruments Incorporated