SN74LVC2T45 Datasheet, PDF (1/22 Pages) Texas Instruments – DUAL BIT DUAL SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS

SN74LVC2T45
DUALĆBIT DUALĆSUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3ĆSTATE OUTPUTS
SCES516E − DECEMBER 2003 − REVISED MAY 2004
D Available in the Texas Instruments
NanoStar and NanoFree Packages
D Fully Configurable Dual-Rail Design Allows
Each Port to Operate Over the Full 1.65-V to
5.5-V Power-Supply Range
D V_CC Isolation Feature − If Either V_CC Input
Is at GND, Both Ports Are in the
High-Impedance State
D DIR Input Circuit Referenced to V_CCA
D Low Power Consumption, 10-µA Max I_CC
D ±24-mA Output Drive at 3.3 V
DCT OR DCU PACKAGE
(TOP VIEW)
D I_off Supports Partial-Power-Down Mode
Operation
D Max Data Rates
− 420 Mbps (3.3-V to 5-V Translation)
− 210 Mbps (Translate to 3.3 V)
− 140 Mbps (Translate to 2.5 V)
− 75 Mbps (Translate to 1.8 V)
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
YEP OR YZP PACKAGE
(BOTTOM VIEW)
V_CCA 1
A1 2
A2 3
GND 4
8 V_CCB
7 B1
6 B2
5 DIR
GND 4 5 DIR
A2 3 6 B2
A1 2 7 B1
V_CCA 1 8 V_CCB
description/ordering information
This dual-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is
designed to track V_CCA. V_CCA accepts any supply voltage from 1.65 V to 5.5 V. The B port is designed to track
V_CCB. V_CCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional
translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
The SN74LVC2T45 is designed for asynchronous communication between data buses. The device transmits
data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
−40°C to 85°C
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SSOP − DCT
Reel of 3000
Reel of 3000
Reel of 250
SN74LVC2T45YEPR
SN74LVC2T45YZPR
SN74LVC2T45DCTR
SN74LVC2T45DCTT
_ _ _TB_
CT2_ _ _
VSSOP − DCU
Reel of 3000
Reel of 250
SN74LVC2T45DCUR
SN74LVC2T45DCUT
CT2_
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.}
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2004, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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