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SN74LVC2GU04_08 Datasheet, PDF (1/14 Pages) Texas Instruments – DUAL INVERTER GATE
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SN74LVC2GU04
DUAL INVERTER GATE
SCES197M – APRIL 1999 – REVISED FEBRUARY 2007
FEATURES
• Available in the Texas Instruments
NanoFree™ Package
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Max tpd of 3.7 ns at 3.3 V
• Low Power Consumption, 10-µA Max ICC
• ±24-mA Output Drive at 3.3 V
• Typical VOLP (Output Ground Bounce) <0.8 V
at VCC = 3.3 V, TA = 25°C
DBV PACKAGE
(TOP VIEW)
• Typical VOHV (Output VOH Undershoot) >2 V at
VCC = 3.3 V, TA = 25°C
• Unbuffered Outputs
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
1A
1
GND
2
6
1Y
1A
1
6 1Y
GND
2
5
VCC
5
VCC
2A
3
4 2Y
2A 3 4 2Y
GND 2 5 VCC
1A 1 6 1Y
2A
3
4
2Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual inverter is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2GU04 contains two inverters with unbuffered outputs and performs the Boolean function Y = A.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
ORDERING INFORMATION
TA
PACKAGE (1)
ORDERABLE PART NUMBER
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
Reel of 3000 SN74LVC2GU04YZPR
–40°C to 85°C SOT (SOT-23) – DBV
Reel of 3000
Reel of 250
SN74LVC2GU04DBVR
SN74LVC2GU04DBVT
SOT (SC-70) – DCK
Reel of 3000
SN74LVC2GU04DCKR
SN74LVC2GU04DCKT
TOP-SIDE MARKING(2)
_ _ _CD_
CU4_
CD_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2007, Texas Instruments Incorporated