SN74LVC2G74 Datasheet, PDF (1/15 Pages) Texas Instruments – SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET

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SN74LVC2G74
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH CLEAR AND PRESET
SCES203K – APRIL 1999 – REVISED JUNE 2005
FEATURES
• Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 5.9 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot)
>2 V at V_CC = 3.3 V, T_A = 25°C
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCT OR DCU PACKAGE
(TOP VIEW)
CLK 1
D2
Q3
GND 4
8 V_CC
7 PRE
6 CLR
5Q
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND 4 5 Q
Q 3 6 CLR
D 2 7 PRE
CLK 1 8 V_CC
DESCRIPTION/ORDERING INFORMATION
This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V V_CC operation.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
T_A
PACKAGE ⁽¹⁾
NanoStar™
WCSP (DSBGA) – YEA
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
SN74LVC2G74YEAR
–40°C to 85°C
NanoFree™
WCSP (DSBGA) – YZA (Pb-free)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000
SN74LVC2G74YZAR
SN74LVC2G74YEPR
SN74LVC2G74YZPR
_ _ _CP_
SSOP – DCT
Reel of 3000 SN74LVC2G74DCTR
C74_ _ _
VSSOP – DCU
Reel of 3000
Reel of 250
SN74LVC2G74DCUR
SN74LVC2G74DCUT
C74_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2005, Texas Instruments Incorporated