SN74LVC2G66_07 Datasheet, PDF (1/19 Pages) Texas Instruments – DUAL BILATERAL ANALOG SWITCH

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FEATURES
• Available in the Texas Instruments
NanoFree™ Package
• 1.65-V to 5.5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 0.8 ns at 3.3 V
• High On-Off Output Voltage Ratio
• High Degree of Linearity
DCT PACKAGE
(TOP VIEW)
1A
1
1B
2
2C
3
GND
4
8
V_CC
7
1C
6
2B
5
2A
SN74LVC2G66
DUAL BILATERAL ANALOG SWITCH
SCES325J – JULY 2001 – REVISED FEBRUARY 2007
• High Speed, Typically 0.5 ns
(V_CC = 3 V, C_L = 50 pF)
• Rail-to-Rail Input/Output
• Low On-State Resistance, Typically ≈6 Ω
(V_CC = 4.5 V)
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
DCU PACKAGE
(TOP VIEW)
1A 1
1B 2
2C 3
GND 4
8
V_CC
7 1C
6 2B
5 2A
YZP PACKAGE
(BOTTOM VIEW)
GND 4 5 2A
2C 3 6 2B
1B 2 7 1C
1A
18
V_CC
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual bilateral analog switch is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC2G66 can handle both analog and digital signals. The device permits signals with amplitudes of
up to 5.5 V (peak) to be transmitted in either direction.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the
associated switch section.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000 SN74LVC2G66YZPR
SSOP – DCT
Reel of 3000 SN74LVC2G66DCTR
VSSOP – DCU
Reel of 3000 SN74LVC2G66DCUR
Reel of 250 SN74LVC2G66DCUT
TOP-SIDE MARKING⁽²⁾
_ _ _C6_
C66_ _ _
C66_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2007, Texas Instruments Incorporated