SN74LVC2G53 Datasheet, PDF (1/18 Pages) Texas Instruments – SINGLE POLE DOUBLE THROW ANALOG SWITCH OR 2:1 ANALOG MULTIPLEXR/DEMULTIPLEXER

SN74LVC2G53
SINGLEĆPOLE DOUBLEĆTHROW (SPDT) ANALOG SWITCH OR
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
SCES324K − JULY 2001 − REVISED SEPTEMBER 2003
D Available in the Texas Instruments
NanoStar and NanoFree Packages
D 1.65-V to 5.5-V V_CC Operation
D High On-Off Output Voltage Ratio
D High Degree of Linearity
D High Speed, Typically 0.5 ns (V_CC = 3 V,
C_L = 50 pF)
D Low On-State Resistance, Typically ≈6.5 Ω
(V_CC = 4.5 V)
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
DCT OR DCU PACKAGE
(TOP VIEW)
COM 1
INH 2
GND 3
GND 4
8 V_CC
7 Y1
6 Y2
5A
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND 4 5 A
GND 3 6 Y2
INH 2 7 Y1
COM 1 8 V_CC
description/ordering information
This dual analog multiplexer/demultiplexer is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC2G53 can handle both analog and digital signals. The device permits signals with amplitudes of
up to 5.5 V (peak) to be transmitted in either direction.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74LVC2G53YEAR
−40°C to 85°C
NanoFree − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
Reel of 3000
SN74LVC2G53YZAR
SN74LVC2G53YEPR
SN74LVC2G53YZPR
_ _ _C4_
SSOP − DCT
Reel of 3000 SN74LVC2G53DCTR C53_ _ _
VSSOP − DCU
Reel of 3000
Reel of 250
SN74LVC2G53DCUR
SN74LVC2G53DCUT
C53_
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.}
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2003, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
1