SN74LVC2G240 Datasheet, PDF (1/11 Pages) Texas Instruments – DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS

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SN74LVC2G240
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES208H – APRIL 1999 – REVISED FEBRUARY 2007
FEATURES
• Available in the Texas Instruments
NanoFree™ Package
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 4.6 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• Typical V_OLP (Output Ground Bounce) <0.8 V
at V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot) >2 V at
V_CC = 3.3 V, T_A = 25°C
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
DCT PACKAGE
(TOP VIEW)
DCU PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
1OE
1
1A
2
2Y
3
8
V_CC
7
2OE
6
1Y
1OE 1
1A 2
2Y 3
GND 4
8
V_CC
7 2OE
6 1Y
5 2A
GND 4 5 2A
2Y 3 6 1Y
1A 2 7 2OE
1OE
18
V_CC
GND
4
5
2A
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual buffer/driver is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC2G240 is designed specifically to improve the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
ORDERING INFORMATION
T_A
–40°C to 85°C
PACKAGE ⁽¹⁾
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
SSOP – DCT
Reel of 3000
Reel of 3000
ORDERABLE PART NUMBER
SN74LVC2G240YZPR
SN74LVC2G240DCTR
VSSOP – DCU
Reel of 3000 SN74LVC2G240DCUR
TOP-SIDE MARKING⁽²⁾
_ _ _CK_
C40_ _ _
C40_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2007, Texas Instruments Incorporated