SN74LVC2G17 Datasheet, PDF (1/13 Pages) Texas Instruments – DUAL SCHMITT TRIGGER BUFFER

SN74LVC2G17
DUAL SCHMITTĆTRIGGER BUFFER
D Available in the Texas Instruments
NanoStar and NanoFree Packages
D Supports 5-V V_CC Operation
D Inputs Accept Voltages to 5.5 V
D Max t_pd of 5.4 ns at 3.3 V
D Low Power Consumption, 10-µA Max I_CC
D ±24-mA Output Drive at 3.3 V
D Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
D Typical V_OHV (Output V_OH Undershoot)
>2 V at V_CC = 3.3 V, T_A = 25°C
D I_off Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 1000-V Charged-Device Model (C101)
SCES381E − JANUARY 2002 − REVISED SEPTEMBER 2003
DBV OR DCK PACKAGE
(TOP VIEW)
1A 1
GND 2
2A 3
6 1Y
5 V_CC
4 2Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
2A 3 4 2Y
GND 2 5 V_CC
1A 1 6 1Y
description/ordering information
This dual Schmitt-trigger buffer is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC2G17 contains two buffers and performs the Boolean function Y = A. The device functions as two
independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going
(V_T+) and negative-going (V_T−) signals.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74LVC2G17YEAR
−40°C to 85°C
NanoFree − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
Reel of 3000
SN74LVC2G17YZAR
SN74LVC2G17YEPR
SN74LVC2G17YZPR
_ _ _C7_
SOT (SOT-23) − DBV
Reel of 3000
Reel of 250
SN74LVC2G17DBVR
SN74LVC2G17DBVT
C17_
SOT (SC-70) − DCK
Reel of 3000 SN74LVC2G17DCKR
C7_
Reel of 250
SN74LVC2G17DCKT
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.}
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2003, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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