SN74LVC2G14 Datasheet, PDF (1/15 Pages) Texas Instruments – DUAL SCHMITT-TRIGGER INVERTER

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FEATURES
• Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 5.4 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot)
>2 V at V_CC = 3.3 V, T_A = 25°C
• I_off Feature Supports Partial-Power-Down
Mode Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
SN74LVC2G14
DUAL SCHMITT-TRIGGER INVERTER
SCES200J – APRIL 1999 – REVISED JUNE 2005
DBV OR DCK PACKAGE
(TOP VIEW)
1A ¹
GND ²
2A ³
6 1Y
5 V_CC
4 2Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
2A 3 4 2Y
GND 2 5 V_CC
1A 1 6 1Y
DESCRIPTION/ORDERING INFORMATION
This dual Schmitt-trigger inverter is designed for 1.65-V to 5.5-V V_CC operation.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
SN74LVC2G14YEAR
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
Reel of 3000
SN74LVC2G14YZAR
SN74LVC2G14YEPR
_ _ _CF_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SN74LVC2G14YZPR
SOT (SOT-23) – DBV
Reel of 3000
Reel of 250
SN74LVC2G14DBVR
SN74LVC2G14DBVT
C14_
SOT (SC-70) – DCK
Reel of 3000 SN74LVC2G14DCKR
CF_
Reel of 250
SN74LVC2G14DCKT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2005, Texas Instruments Incorporated