SN74LVC2G07_07 Datasheet, PDF (1/13 Pages) Texas Instruments – DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

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FEATURES
• Available in the Texas Instruments
NanoFree™ Package
• Supports 5-V V_CC Operation
• Inputs and Open-Drain Outputs Accept
Voltages up to 5.5 V
• Max t_pd of 3.7 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
DBV PACKAGE
(TOP VIEW)
1A
1
6
1Y
GND
2
5
V_CC
SN74LVC2G07
DUAL BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
SCES308G – AUGUST 2001 – REVISED JANUARY 2007
• Typical V_OHV (Output V_OH Undershoot)
>2 V at V_CC = 3.3 V, T_A = 25°C
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
1A
1
GND
2
2A
3
6 1Y
5
V_CC
4 2Y
2A ^{3 4} 2Y
GND ^{2 5 V}_CC
1A ^{1 6} 1Y
2A
3
4
2Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual buffer/driver is designed for 1.65-V to 5.5-V V_CC operation. The output of the SN74LVC2G07 is open
drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high
wired-AND functions. The maximum sink current is 32 mA.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000 SN74LVC2G07YZPR
_ _ _CV_
SOT (SOT-23) – DBV
Reel of 3000 SN74LVC2G07DBVR
C07_
SOT (SC-70) – DCK
Reel of 3000 SN74LVC2G07DCKR
CV_
Reel of 250 SN74LVC2G07DCKT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2007, Texas Instruments Incorporated