SN74LVC2G07 Datasheet, PDF (1/13 Pages) Texas Instruments – DUAL BUFFER/DRIVER WITH OPEN DRAIN OUTPUTS

D Available in the Texas Instruments
NanoStar and NanoFree Packages
D Supports 5-V V_CC Operation
D Inputs and Open-Drain Outputs Accept
Voltages Up To 5.5 V
D Max t_pd of 3.7 ns at 3.3 V
D Low Power Consumption, 10-µA Max I_CC
D ±24-mA Output Drive at 3.3 V
D Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
D Typical V_OHV (Output V_OH Undershoot)
>2 V at V_CC = 3.3 V, T_A = 25°C
D I_off Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
SN74LVC2G07
DUAL BUFFER/DRIVER
WITH OPENĆDRAIN OUTPUTS
SCES308E − AUGUST 2001 − REVISED SEPTEMBER 2003
DBV OR DCK PACKAGE
(TOP VIEW)
1A ¹
GND ²
2A ³
6 1Y
5 V_CC
4 2Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
2A 3 4 2Y
GND 2 5 V_CC
1A 1 6 1Y
description/ordering information
This dual buffer/driver is designed for 1.65-V to 5.5-V V_CC operation. The output of the SN74LVC2G07 is open
drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high
wired-AND functions. The maximum sink current is 32 mA.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74LVC2G07YEAR
−40°C to 85°C
NanoFree − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
Reel of 3000
SN74LVC2G07YZAR
SN74LVC2G07YEPR
SN74LVC2G07YZPR
_ _ _CV_
SOT (SOT-23) − DBV
Reel of 3000 SN74LVC2G07DBVR
C07_
SOT (SC-70) − DCK
Reel of 3000 SN74LVC2G07DCKR
CV_
Reel of 250 SN74LVC2G07DCKT
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.}
YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2003, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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