SN74LVC2G06 Datasheet, PDF (1/12 Pages) Texas Instruments – DUAL INVERTER BUFFER/DRIVER WITH OPEN DRAIN OUTPUTS

D Available in the Texas Instruments
NanoStar and NanoFree Packages
D Supports 5-V V_CC Operation
D Max t_pd of 3.4 ns at 3.3 V
D Low Power Consumption, 10-µA Max I_CC
D ±24-mA Output Drive at 3.3 V
D Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
D Typical V_OHV (Output V_OH Undershoot)
>2 V at V_CC = 3.3 V, T_A = 25°C
D Inputs and Open-Drain Outputs Accept
Voltages up to 5.5 V
D I_off Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
SN74LVC2G06
DUAL INVERTER BUFFER/DRIVER
WITH OPENĆDRAIN OUTPUTS
SCES307E − AUGUST 2001 − REVISED SEPTEMBER 2003
DBV OR DCK PACKAGE
(TOP VIEW)
1A 1
GND 2
2A 3
6 1Y
5 V_CC
4 2Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
2A 3 4 2Y
GND 2 5 V_CC
1A 1 6 1Y
description/ordering information
This dual inverter buffer/driver is designed for 1.65-V to 5.5-V V_CC operation.
The output of the SN74LVC2G06 device is open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74LVC2G06YEAR
−40°C to 85°C
NanoFree − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Tape and reel
SN74LVC2G06YZAR
SN74LVC2G06YEPR
_ _ _CT_
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SN74LVC2G06YZPR
SOT (SOT-23) − DBV
−40°C to 85°C
SOT (SC-70) − DCK
Tape and reel
Tape and reel
SN74LVC2G06DBVR
SN74LVC2G06DCKR
C06_
CT_
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.}
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2003, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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