SN74LVC1G99 Datasheet, PDF (1/18 Pages) Texas Instruments – ULTRA-CONFIGURABLE MULTIPLE-FUNCTION GATE WITH 3-STATE OUTPUTS

SN74LVC1G99
ULTRAĆCONFIGURABLE MULTIPLEĆFUNCTION GATE
WITH 3ĆSTATE OUTPUTS
SCES609B − SEPTEMBER 2004 – REVISED JANUARY 2005
D Available in Texas Instruments NanoStar
and NanoFree Packages
D Supports 5-V V_CC Operation
D Inputs Accept Voltages to 5.5 V
D Max t_pd of 6.7 ns at 3.3 V
D Low Power Consumption, 10-µA Max I_CC
D ±24-mA Output Drive at 3.3 V
D Offers Nine Different Logic Functions in a
Single Package
D I_off Supports Partial-Power-Down Mode
Operation
D Input Hysteresis Allows for Slow Input
Transition Time and Better Noise Immunity
at Input
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
DCT OR DCU PACKAGE
(TOP VIEW)
OE 1
A2
B3
GND 4
8 V_CC
7Y
6D
5C
YEP OR YZP PACKAGE
(BOTTOM VIEW)
GND 4 5 C
B 36 D
A 27 Y
OE 1 8 V_CC
description/ordering information
The SN74LVC1G99 is operational from 1.65 V to 5.5 V.
The SN74LVC1G99 features configurable multiple functions with a 3-state output. The output is disabled when
the output-enable (OE) input is high. When OE is low, the output state is determined by 16 patterns of 4-bit input.
The user can choose logic functions, such as MUX, AND, OR, NAND, NOR, XOR, XNOR, inverter, and buffer.
All inputs can be connected to V_CC or GND.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
−40°C to 85°C
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SSOP − DCT
Reel of 3000
Reel of 3000
Reel of 250
SN74LVC1G99YEPR
SN74LVC1G99YZPR
SN74LVC1G99DCTR
SN74LVC1G99DCTT
DE_
C99_ _ _
VSSOP − DCU
Reel of 3000
Reel of 250
SN74LVC1G99DCUR
SN74LVC1G99DCUT
C99_
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.}
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2005, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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