SN74LVC1G98_10 Datasheet, PDF (1/18 Pages) Texas Instruments – CONFIGURABLE MULTIPLE-FUNCTION GATE

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FEATURES
SN74LVC1G98
CONFIGURABLE MULTIPLE-FUNCTION GATE
SCES417J – DECEMBER 2002 – REVISED JANUARY 2007
• Available in the Texas Instruments
NanoFree™ Package
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 6.3 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DBV PACKAGE
(TOP VIEW)
In1
1
6
GND
2
5
In2
V_CC
DCK PACKAGE
(TOP VIEW)
In1
1
6 In2
GND
2
5
V_CC
In0
3
4Y
DRL PACKAGE
(TOP VIEW)
In1 1
GND 2
In0 3
6 In2
5 V_CC
4Y
YZP PACKAGE
(BOTTOM VIEW)
In0 ^{3 4} Y
GND ^{2 5 V}CC
In1 ^{1 6} In2
In0
3
4
Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This configurable multiple-function gate is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G98 features configurable multiple functions. The output state is determined by eight patterns of
3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All
inputs can be connected to V_CC or GND.
This device functions as an independent gate, but because of Schmitt action, it may have different input
threshold levels for positive-going (V_T+) and negative-going (V_T–) signals.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T_A
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000 SN74LVC1G98YZPR
_ _ _CW_
SOT (SOT-23) – DBV
–40°C to 85°C
SOT (SC-70) – DCK
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
SN74LVC1G98DBVR
SN74LVC1G98DBVT
SN74LVC1G98DCKR
SN74LVC1G98DCKT
C98_
CW_
SOT (SOT-563) – DRL
Reel of 4000 SN74LVC1G98DRLR
CW_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2007, Texas Instruments Incorporated