SN74LVC1G80 Datasheet, PDF (1/22 Pages) Texas Instruments – SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

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SN74LVC1G80
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
SCES221O – APRIL 1999 – REVISED JUNE 2005
FEATURES
• Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 4.2 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DBV OR DCK PACKAGE
(TOP VIEW)
D1
CLK 2
GND 3
5 V_CC
4Q
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND 3 4 Q
CLK 2
D 1 5 V_CC
DESCRIPTION/ORDERING INFORMATION
This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V V_CC operation.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the
positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the
rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting
the level at the output.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
SN74LVC1G80YEAR
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
Reel of 3000
SN74LVC1G80YZAR
SN74LVC1G80YEPR
_ _ _CX_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SN74LVC1G80YZPR
SOT (SOT-23) – DBV
Reel of 3000
Reel of 250
SN74LVC1G80DBVR
SN74LVC1G80DBVT
C80_
SOT (SC-70) – DCK
Reel of 3000 SN74LVC1G80DCKR
CX_
Reel of 250
SN74LVC1G80DCKT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2005, Texas Instruments Incorporated