SN74LVC1G66_09 Datasheet, PDF (1/20 Pages) Texas Instruments – SINGLE BILATERAL ANALOG SWITCH

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SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
SCES323L – JUNE 2001 – REVISED JANUARY 2007
FEATURES
• Available in the Texas Instruments
NanoFree™ Package
• 1.65-V to 5.5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 0.8 ns at 3.3 V
• High On-Off Output Voltage Ratio
• High Degree of Linearity
• High Speed, Typically 0.5 ns
(V_CC = 3 V, C_L = 50 pF)
DBV PACKAGE
(TOP VIEW)
• Low On-State Resistance, Typically ≈5.5 Ω
(V_CC = 4.5 V)
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
A
1
B
2
5
V_CC
A
1
5
V_CC
B
2
A1
B2
5 V_CC GND ^{3 4 C}
B²
GND 3 4 C
A ^{1 5} V_CC
GND
3
4C
GND
3
4
C
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This single analog switch is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of
up to 5.5 V (peak) to be transmitted in either direction.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
T_A
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
Reel of 3000 SN74LVC1G66YZPR
–40°C to 85°C ^{SOT (SOT-23) – DBV}
Reel of 3000
Reel of 250
SN74LVC1G66DBVR
SN74LVC1G66DBVT
SOT (SC-70) – DCK
Reel of 3000
Reel of 250
SN74LVC1G66DCKR
SN74LVC1G66DCKT
SOT (SOT-553) – DRL
Reel of 4000 SN74LVC1G66DRLR
TOP-SIDE MARKING⁽²⁾
_ _ _C6_
C66_
C6_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2007, Texas Instruments Incorporated