SN74LVC1G66 Datasheet, PDF (1/17 Pages) Texas Instruments – SINGLE BILATERAL ANALOG SWITCH

SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
D Available in the Texas Instruments
NanoStar and NanoFree Packages
D 1.65-V to 5.5-V V_CC Operation
D Inputs Accept Voltages to 5.5 V
D Max t_pd of 0.8 ns at 3.3 V
D High On-Off Output Voltage Ratio
D High Degree of Linearity
D High Speed, Typically 0.5 ns
(V_CC = 3 V, C_L = 50 pF)
D Low On-State Resistance, Typically ≈5.5 Ω
(V_CC = 4.5 V)
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
SCES323H − JUNE 2001 − REVISED SEPTEMBER 2003
DBV OR DCK PACKAGE
(TOP VIEW)
A¹
B²
GND ³
5 V_CC
4C
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND 3 4 C
B2
A 1 5 V_CC
description/ordering information
This single analog switch is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of
up to 5.5 V (peak) to be transmitted in either direction.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74LVC1G66YEAR
−40°C to 85°C
NanoFree − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Reel of 3000
SN74LVC1G66YZAR
SN74LVC1G66YEPR
_ _ _C6_
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SN74LVC1G66YZPR
−40°C to 85°C
SOT (SOT-23) − DBV
SOT (SC-70) − DCK
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
SN74LVC1G66DBVR
SN74LVC1G66DBVT
SN74LVC1G66DCKR
SN74LVC1G66DCKT
C66_
C6_
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.}
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2003, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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