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SN74LVC1G58 Datasheet, PDF (1/16 Pages) Texas Instruments – CONFIGURABLE MULTIPLE-FUNCTION GATE
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SN74LVC1G58
CONFIGURABLE MULTIPLE-FUNCTION GATE
SCES415I – NOVEMBER 2002 – REVISED JUNE 2005
FEATURES
• Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Max tpd of 6.3 ns at 3.3 V
• Low Power Consumption, 10-µA Max ICC
• ±24-mA Output Drive at 3.3 V
• Ioff Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
YEA, YEP, YZA,
OR YZP PACKAGE
(BOTTOM VIEW)
In1
1
GND
2
In1
1
6 In2
In1 1
6 In2
In0 3 4 Y
6
5
In2
GND
VCC
In0
2
3
5
VCC
GND 2
In0 3
5 VCC
4Y
GND 2 5
In1 1 6
VCC
In2
4Y
In0
3
4
Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This configurable multiple-function gate is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G58 features configurable multiple functions. The output state is determined by eight patterns of
3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XOR, inverter, and noninverter. All
inputs can be connected to VCC or GND.
This device functions as an independent gate, but because of Schmitt action, it may have different input
threshold levels for positive-going (VT+) and negative-going (VT–) signals.
TA
–40°C to 85°C
ORDERING INFORMATION
PACKAGE (1)
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
SN74LVC1G58YEAR
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
Tape and reel
SN74LVC1G58YZAR
SN74LVC1G58YEPR
_ _ _CP_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SN74LVC1G58YZPR
SOT (SOT-23) – DBV
Tape and reel SN74LVC1G58DBVR
C58_
SOT (SC-70) – DCK
Tape and reel SN74LVC1G58DCKR
CP_
SOT (SOT-553) – DRL
Reel of 4000 SN74LVC1G58DRLR
CP_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2005, Texas Instruments Incorporated