SN74LVC1G38 Datasheet, PDF (1/12 Pages) Texas Instruments – SINGLE 2-INPUT NAND GATE WITH OPEN-DRAIN OUTPUT

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FEATURES
• Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 4.5 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN74LVC1G38
SINGLE 2-INPUT NAND GATE
WITH OPEN-DRAIN OUTPUT
SCES538A – JANUARY 2004 – REVISED APRIL 2005
DBV OR DCK PACKAGE
(TOP VIEW)
A¹
B²
GND ³
5 V_CC
4Y
YEP OR YZP PACKAGE
(BOTTOM VIEW)
GND 3 4 Y
B2
A 1 5 V_CC
DESCRIPTION/ORDERING INFORMATION
The SN74LVC1G38 is designed for 1.65-V to 5.5-V V_CC operation.
This device is a single two-input NAND buffer gate with open-drain output. It performs the Boolean function
Y = A ⋅ B or Y = A + B in positive logic.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
T_A
PACKAGE ⁽¹⁾
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
–40°C to 85°C
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
ORDERABLE PART NUMBER
SN74LVC1G38YEPR
Reel of 3000
SN74LVC1G38YZPR
Reel of 3000 SN74LVC1G38DBVR
Reel of 250 SN74LVC1G38DBVT
SOT (SC-70) – DCK
Reel of 3000 SN74LVC1G38DCKR
Reel of 250 SN74LVC1G38DCKT
TOP-SIDE MARKING⁽²⁾
_ _ _D7_
C38_
D7_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ⋅ = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated