SN74LVC1G3157_07 Datasheet, PDF (1/23 Pages) Texas Instruments – SINGLE-POLE,DOUBLE-THROW ANALOG SWITCH

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FEATURES
• 1.65-V to 5.5-V V_CC Operation
• Useful for Both Analog and Digital
Applications
• Specified Break-Before-Make Switching
• Rail-to-Rail Signal Handling
• High Degree of Linearity
• High Speed, Typically 0.5 ns
(V_CC = 3 V, C_L = 50 pF)
DBV PACKAGE
(TOP VIEW)
SN74LVC1G3157
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH
SCES424F – JANUARY 2003 – REVISED FEBRUARY 2007
• Low On-State Resistance, Typically ≈6 Ω
(V_CC = 4.5 V)
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
B2
1
6
S
B2
1
6S
B2 1 6 S
GND
2
5
V_CC ^{GND 2}
5 V_CC
GND
2
5
V_CC
B1
3
4A
B1 3 4 A
B1
3
4
A
DRY PACKAGE
(TOP VIEW)
B2 1
GND 2
B1 3
6S
5 V_CC
4A
YZP PACKAGE
(BOTTOM VIEW)
B1 ^{3 4}
GND ^{2 5}
B2 ^{1 6}
A
V_CC
S
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This single-pole, double-throw (SPDT) analog switch is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G3157 can handle both analog and digital signals. The device permits signals with amplitudes of
up to V_CC (peak) to be transmitted in either direction.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
T_A
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000 SN74LVC1G3157YZPR
_ _ _ C5_
SON – DRY
–40°C to 85°C _{SOT (SOT-23) – DBV}
Reel of 5000
Reel of 3000
SN74LVC1G3157DRYR
SN74LVC1G3157DBVR
C5_
CC5_
SOT (SC-70) – DCK
Reel of 3000 SN74LVC1G3157DCKR
C5_
SOT (SOT-553) – DRL
Reel of 4000 SN74LVC1G3157DRLR
C5_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2007, Texas Instruments Incorporated