SN74LVC1G3157 Datasheet, PDF (1/16 Pages) Texas Instruments – SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH

SN74LVC1G3157
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH
D 1.65-V to 5.5-V V_CC Operation
D Useful for Both Analog and Digital
Applications
D Specified Break-Before-Make Switching
D Rail-to-Rail Signal Handling
D High Degree of Linearity
D High Speed, Typically 0.5 ns
(V_CC = 3 V, C_L = 50 pF)
D Low On-State Resistance, Typically ≈6 Ω
(V_CC = 4.5 V)
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SCES424C – JANUARY 2003 - REVISED SEPTEMBER 2003
DBV OR DCK PACKAGE
(TOP VIEW)
B2 1
GND 2
B1 3
6S
5 V_CC
4A
YEP OR YZP PACKAGE
(BOTTOM VIEW)
B1 3 4 A
GND 2 5 V_CC
B2 1 6 S
description/ordering information
This single-pole, double-throw (SPDT) analog switch is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G3157 can handle both analog and digital signals. The device permits signals with amplitudes
of up to V_CC (peak) to be transmitted in either direction.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
–40°C to 85°C
NanoStar – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Tape and reel
SN74LVC1G3157YEPR
SN74LVC1G3157YZPR
_ _ _C5_
SOT (SOT-23) – DBV
Tape and reel SN74LVC1G3157DBVR CC5_
SOT (SC-70) – DCK
Tape and reel SN74LVC1G3157DCKR C5_
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.}
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright  2003, Texas Instruments Incorporated
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