SN74LVC1G240_08 Datasheet, PDF (1/14 Pages) Texas Instruments – SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT

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SN74LVC1G240
SINGLE BUFFER/DRIVER
WITH 3-STATE OUTPUT
SCES305J – JANUARY 2001 – REVISED JANUARY 2007
FEATURES
• Available in the Texas Instruments
NanoFree™ Package
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 3.7 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
OE
1
5
V_CC
OE
1
5
V_CC
A
2
A
2
GND
3
4Y
GND ^{3 4} Y
A²
OE ^{1 5 V}_CC
GND
3
4
Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This single buffer/driver is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G240 is a single line driver with a 3-state output. The output is disabled when the output-enable
(OE) input is high.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
To ensure the high-impedance state during power up or power down, OE should be tied to V_CC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T_A
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000
SN74LVC1G240YZPR
–40°C to 85°C ^{SOT (SOT-23) – DBV}
Reel of 3000 SN74LVC1G240DBVR
Reel of 250 SN74LVC1G240DBVT
SOT (SC-70) – DCK
Reel of 3000 SN74LVC1G240DCKR
Reel of 250 SN74LVC1G240DCKT
TOP-SIDE MARKING⁽²⁾
_ _ _CK_
C40_
CK_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2007, Texas Instruments Incorporated