SN74LVC1G240 Datasheet, PDF (1/13 Pages) Texas Instruments – SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT

D Available in the Texas Instruments
NanoStar and NanoFree Packages
D Supports 5-V V_CC Operation
D Inputs Accept Voltages to 5.5 V
D Max t_pd of 3.7 ns at 3.3 V
D Low Power Consumption, 10-µA Max I_CC
D ±24-mA Output Drive at 3.3 V
D I_off Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
SN74LVC1G240
SINGLE BUFFER/DRIVER
WITH 3ĆSTATE OUTPUT
SCES305H − JANUARY 2001 − REVISED OCTOBER 2003
DBV OR DCK PACKAGE
(TOP VIEW)
OE ¹
A²
GND ³
5 _VCC
4_Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND 3 4 Y
A2
OE 1 5 V_CC
description/ordering information
This single buffer/driver is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G240 is a single line driver with a 3-state output. The output is disabled when the output-enable
(OE) input is high.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
To ensure the high-impedance state during power up or power down, OE should be tied to V_CC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74LVC1G240YEAR
−40°C to 85°C
NanoFree − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
Reel of 3000
SN74LVC1G240YZAR
SN74LVC1G240YEPR
_ _ _CK_
SN74LVC1G240YZPR
SOT (SOT-23) − DBV
Reel of 3000
Reel of 250
SN74LVC1G240DBVR
SN74LVC1G240DBVT
C40_
SOT (SC-70) − DCK
Reel of 3000
Reel of 250
SN74LVC1G240DCKR
CK_
SN74LVC1G240DCKT
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.}
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2003, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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