SN74LVC1G19 Datasheet, PDF (1/11 Pages) Texas Instruments – 1-OF-2 DECODER/DEMULTIPLEXER

SN74LVC1G19
1ĆOFĆ2 DECODER/DEMULTIPLEXER
D Available in the Texas Instruments
NanoStar and NanoFree Packages
D Supports 5-V V_CC Operation
D Inputs Accept Voltages to 5.5 V
D Max t_pd of 4 ns at 3.3 V
D Low Power Consumption, 10-µA Max I_CC
D ±24-mA Output Drive at 3.3 V
D Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
D Typical V_OHV (Output V_OH Undershoot)
>2 V at V_CC = 3.3 V, T_A = 25°C
D I_off Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
SCES464B − JUNE 2003 − REVISED SEPTEMBER 2003
DBV OR DCK PACKAGE
(TOP VIEW)
A¹
GND ²
E³
6 Y0
5 V_CC
4 Y1
YEP OR YZP PACKAGE
(BOTTOM VIEW)
E 3 4 Y1
GND 2 5 V_CC
A 1 6 Y0
description/ordering information
This decoder/demultiplexer is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G19 is a 1-of-2 decoder/demultiplexer. This device buffers the data on input A and passes it
to the outputs Y0 (true) and Y1 (complement) when the enable (E) input signal is low.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
−40°C to 85°C
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SOT (SOT-23) − DBV
Reel of 3000
Reel of 3000
Reel of 250
SN74LVC1G19YEPR
SN74LVC1G19YZPR
SN74LVC1G19DBVR
SN74LVC1G19DBVT
_ _ _CY_
C19_
SOT (SC-70) − DCK
Reel of 3000 SN74LVC1G19DCKR
CY_
Reel of 250 SN74LVC1G19DCKT
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.}
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2003, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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